Andon's BGA Sockets and Adapters provide an ideal method for mounting ball grid array devices onto a PCB. The device is soldered to the adapter, greatly simplifying solder verification and testing. The device/adapter assembly then plugs into the BGA socket which is permanently soldered to the PCB. The BGA adapter is offered with either flat or countersunk heads.

Our BGA sockets can be surface or thru-hole mounted. Socket insulators are made of FR-4 to withstand convection or IR soldering. Andon BGA sockets and adapters are available in virtually any size or configuration, using off-the-shelf or custom designed screw machined terminals.

1.27mm (.050 inch) Pitch BGA Sockets and Adapters Rollerball® Grid Array Socketing System Series 10

We have attempted to present the information about our vendor's products on this website in a straight-forward manner. We offer this information as accurate at the time of publication. Specifications are subject to change without notice. Electro-Stock, Inc. is not responsible for inadvertent errors.

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Since 1983   

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